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Analysis on the grinding and polishing process of fiber optic connector and the cause of defects

Date: 2017-12-05 Author: admin

1. The reasons for the polishing of fiber optic connectors
Optical fiber connector as one of the most important optical passive devices for fiber system, requires lower insertion loss and higher return loss in performance, so as to improve the reliability of optical fiber transmission system. To evaluate the quality of optical fiber connector, we need to measure the shape parameters of connector pin end face after grinding and polishing, including three important parameters, such as radius of curvature, vertex offset and core depression. Only if the shape parameters of the end face are guaranteed within a certain range, can the optical fiber maintain good physical contact. In addition, we should try to remove the deterioration layer of the optical fiber end and test whether there is scratches or other fouling on the end of the fiber. At last, the performance of low insertion loss and high echo loss should be satisfied. Therefore, the lapping and polishing process of fiber optic connectors to improve it
Optical performance is very critical.
2, the polishing process of fiber optic connector
The optical fiber grinding process is the result of the integrated effect of a number of single abrasive particles on the surface of the surface of the abrasive paper.
Four grinding methods: degumming bag - coarse grinding - seminal grinding - fine grinding - polishing
(1) for outsourced ceramic sleeves, optical fiber connectors, such as FC, SC, ST and LC connectors, are mainly made of diamond series abrasive chips and polished with ADS. Grinding process: SC30/15-D9-D6-D3-D1-ADS/ cerium oxide polishing film +SiO2 polishing solution, or SC30/15-D9-D3-D1-ADS/ cerium oxide polishing film +SiO2 polishing solution, or SC30/15-D9-D1-ADS/ cerium oxide polishing film +SiO2 polishing solution. The SC30/15 silicon carbide abrasive sheet for plastic package; D9 or D6 or D3 diamond abrasive sheet used for coarse grinding; D1 diamond grinding blade used for semi finishing grinding; diamond grinding blade used for grinding D0.5. The ADS/ cerium oxide polishing film +SiO2 polishing solution is used for polishing. The rubbing pad is made of rubber pads.
(2) fiber optic connector of APC ceramic sleeve, first in the grinding process


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